The connecting process of non-solid soluble metal silver and tantalum mainly includes: pretreatment of the connected tantalum and silver; The mixture of tantalum powder and silver powder is pressed into a blank with a thickness of 2-5 mm; Stack in the order of tantalum, billet and silver; The tantalum, billet and silver stacked in sequence are fixed and pressured so that the tantalum to be connected and the silver to be connected are closely fitted to the billet; Tantalum, billet and silver in a fixed and pressurized state are annealed, and the annealing temperature of the annealing treatment is lower than the melting point of silver by 10-50 degrees Celsius. The technical scheme provided by the invention not only has the characteristics of simple process and low connection cost, but also can make the metal bonding interface between non-solid soluble tantalum and silver uniform and continuous, and make the non-solid soluble tantalum and silver have better bonding strength.
With the rapid development of science and technology, people have higher and higher requirements for the performance of materials, because the performance of a single metal material sometimes can not meet people's actual needs, and polyphase metal materials have better performance in some application scenarios. Polyphase metal materials have been widely used in many industries such as electronic technology industry, aerospace industry and automobile industry.
The formation of polyphase metal materials sometimes involves the connection between different metal materials. When the two metal materials to be connected are solidly dissolved with each other, because the two metal materials that are solidly dissolved with each other have good wetting and solidly dissolved properties, it is easier to connect the two metal materials that are solidly dissolved with each other. When the two metal materials to be connected are not solidly soluble (non-solidly soluble means that the solid solubility between the two metal materials is small, or even zero), because the reaction heat of the two metals that are not solidly soluble is positive, and its wettability is poor, it is difficult to connect the two metal materials that are not solidly soluble together.
At present, the existing methods of interconnecting non-solidly soluble metals include: the metal or alloy that is solidly soluble with the two kinds of metal materials to be connected is used as the intermediate layer, and the interdiffusion between the intermediate layer and the two kinds of metal materials to be connected is used to realize the connection between the two kinds of metal materials to be connected; For example, in the case that Cu(copper) with good electrical and thermal conductivity and Mo(Molybdenum) with good low thermal expansion coefficient, high temperature strength and wear resistance are needed to be connected together, metal Ni(nickel) can be used as an intermediate layer, and Mo and Cu can be successfully connected together through the diffusion of Ni and Mo and Cu. And its maximum bonding strength can reach 97Mpa. However, the introduction of other metal materials between two non-solid soluble metal materials will not only change the material composition of the connector, but also easily have an adverse effect on the additional properties of the material in a specific application environment (such as ferromagnetism, etc.).
