The forging method of rotating target ingots for niobium comprises the following steps: the ingots are preheated for the first time, and the surface of the ingots after preheating is coated with the first anti-oxidation coating; The ingots coated with the first anti-oxidation coating were subjected to the first hot forging, and the ingots were subjected to the first heat treatment. The niobium ingot after the first heat treatment is hot forged for a second time, and the niobium ingot after the second hot forging is heat treated for a second time. The invention mainly adopts forging method to process the niobium ingot, so that the columnar crystal area of the middle part and the core part of the ingot can be fully broken, so as to improve the uneven degree of the cast structure of the niobium ingot; On the other hand, the presence of dendrites, crystal bands, non-equiaxed crystals and coarse crystals in the casting state of niobium ingot was eliminated by two forging processes, and the internal grain structure of the ingot was fully refined, and finally the niobium billet for the rotating target of niobium with uniform internal grains was obtained.
Magnetron sputtering is one of the main technologies for the preparation of thin film materials. It uses an ion source to produce ions, which are accelerated to gather in a vacuum environment to form an ion beam with high speed energy, which bombards the solid surface. Kinetic energy exchange occurs between ions and atoms on the solid surface, so that atoms on the solid surface leave the solid surface and deposit on the substrate surface. The bombarded solid is the raw material for deposition of the film by sputtering method, which is called the sputtering target.
The shape of sputtering target is cuboid, cube, cylinder and irregular shape. Cuboid, cuboid and cylindrical shape targets are solid. During sputtering, annular permanent magnets establish a ring magnetic field on the surface of the target and form an etching zone on the annular surface equidistant from the axes. The disadvantage is that the uniformity of film deposition thickness is not easy to control, and the utilization rate of the target is low, only 20%~30%. At present, the rotary hollow tube magnetron sputtering target is widely used at home and abroad, and its advantage is that the hollow tube target can be rotated around the fixed bar magnet assembly, so that the 360° target surface can be evenly etched, and the utilization rate is as high as 80%. In general, the grain size of the sputtering target must be controlled below 100 microns, and even the tendency of its crystalline structure must be strictly controlled.
