The preparation method of large-size, fine-crystal molybdenum tantalum alloy sputtering target includes the steps of cold isostatic pressing, sintering, flattening, hot isostatic pressing, rolling and machining by combining steel die and rubber sheet. The grain size of the produced target is less than 50 microns, and the change of grain size is maintained within 20%, and the grains are uniformly distributed in the plane direction and thickness direction of the target. The relative density of the target material is > 97%. Moreover, it can produce large-size sputtering targets with a length of about 2m and a width of about 1.3m.
The film deposited by target sputtering has high density and good adhesion to substrate. Sputtering thin film materials have been widely used in semiconductor integrated circuits, recording media, plane display and workpiece surface coating. Therefore, the demand for sputtering targets, a functional material with high added value, is increasing year by year. In recent years, the rapid development of China's electronic information industry, integrated circuit, optical disc and display production lines have a large number of joint ventures or wholly-owned enterprises appear, China has gradually become one of the world's largest demand areas for film targets. But so far, China still has no professional large companies specializing in the production of target materials, and a large number of target materials are still imported from abroad. Especially for the alloy target, the alloy temperature is high and the plasticity is low, which can not be produced by rolling. The use of powder metallurgy molding, that is, molybdenum powder after cold isostatic pressing treatment, sintering, rolling, machining and bonding with the backplane, made of the target in the process of sputtering coating, sputtering target is bombarded, due to the sudden release of gas in the internal pores of the target, resulting in large size of the target particles or particles splashing, Or after the film is formed, the film material is subjected to secondary electron bombardment resulting in the splash of particles. Due to the lagging development of the domestic target industry, a large part of China's target market is occupied by foreign companies. With the rapid development of microelectronics and other high-tech industries, China's target market will expand day by day, providing opportunities and challenges for the development of China's target manufacturing industry.
The prepared sputtering target has a relatively high density, and the target surface of the target is not easy to produce nodules during the sputtering process, and the flashover phenomenon is effectively suppressed, and the probability of impurity defects in the formed film is reduced. And there will be no large number of holes in the target of the high-density target, so as to ensure the purity and composition uniformity of the film during sputtering.
