In sputtering coating, can be as simple as the use of electronic or high-energy laser bombardment of target, and the surface components form groups of atoms, or ions was sputtering, and eventually deposited on the substrate surface, experience the film-forming process, ultimately form a thin film.
The sputtering coating can be divided into many kinds, and in general, the difference of evaporation coating is that the sputtering rate will become one of the main parameters. Sputtering coating of laser sputtering coating PLD, composition uniformity, easy to maintain, and the thickness of the atomic scale relatively poor uniformity (because is pulsed sputtering), the growth of the crystal (outer) to control is more general.
PLD, for example, the major factors are: the crystal lattice of the target material and the substrate match coating atmosphere (low pressure gas atmosphere) substrate temperature, laser power pulse frequency sputtering time For different sputtering materials and substrates, need to experiment to determine the best parameters, are each are not identical, the stand or fall of coating equipment mainly depends on whether the precise temperature control, ensure good vacuum degree, can guarantee a good vacuum cavity cleanness.
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