Tantalum sputtering target material is the tantalum sheet material obtained through pressure processing, with high chemical purity, small grain size, recrystallization texture and good consistency in three axes. It is mainly used for sputtering deposition of optical fiber, semiconductor chip and integrated circuit.
Smelting performance
Ta3N5 tantalum target material
1) no cracks, obvious pits, oil and dirt marks shall be found on the surface.
2) tantalum plates shall have an isoaxial, completely recrystallized microscopic grain structure.
3) the average grain size shall conform to ASTM 4.0 (less than 80 m or finer, tested in accordance with ASTM E12). The grain size shall be mainly equiaxed and uniform and stable across the thickness section.
4) the material shall have a uniform texture dominated by a certain orientation, other orientation can be arbitrary, and there shall be no {100} crystal belt greater than 0.254mm2.
5) there shall be no loose and inclusion in the target material surface at 200 times magnification.
