Plane niobium target material is mainly used in coating industry, by high energy particles hit target material with high purity solid tablet, according to the physical process hits the atoms, and access to the sputtering chamber gas at the same time, with the sputtering hits the target atom reaction, formation of coating materials, and eventually deposited on the substrate material, film formation has certain characteristics. The sputtering target material requires uniform composition, appropriate particle size and specific crystallographic orientation. The high requirement of the sputtering target material is to obtain uniform film deposition rate on the whole substrate. Niobium target material is mainly used in surface engineering materials, such as ship, chemical industry, liquid crystal display and coating industry with heat and corrosion resistance and high conductivity. Planar niobium target is a niobium target with a diameter greater than or equal to 150_, which is usually called a bare target. During use, the user first welds it with a copper or aluminum back target, then sputtering, depositing niobium atoms on the substrate material to achieve sputtering coating. In order to achieve uniform film formation, niobium ingot must be broken to produce crystal to ensure complete recrystallization of internal structure of niobium target and uniform grain size less than 100. Preparation of planar niobium target materials.
Tag: niobium target， sputtering target material
