The target material is a material used as a cathode in sputtering deposition technology, which can be separated from the cathode in the form of molecules, atoms or ions and redeposited on the surface of the anode under the impact of positively charged cations. As a kind of special electronic material with high added value, the target material is widely used in the thin film material of sputtering technology. According to the application, the target materials mainly include the target materials for the semiconductor field, the target materials for the recording medium, the target materials for the display film, the advanced touch screen and the display, the optical target materials and the superconducting target materials. Magnetron sputtering is one of the main technology of preparation of thin film materials, it USES ion source to produce ions, the ion through accelerating gathered in the vacuum environment, to form the high speed of ion beam, bombarding solid surface, kinetic energy of the exchange of atoms, ions and solid surface from solid surface atomic solid surface and deposition on the surface of the matrix. The bombarded solids are raw materials for the deposition of thin films by sputtering and are called sputtering targets.
The shapes of the sputtering target include cuboid, cube, cylinder and irregular shape. In the sputtering process, the circular annular permanent magnet creates an annular magnetic field on the surface of the target material and forms an etching area on the annular surface with equal distance between the axes. The disadvantage is that the thickness uniformity of the film deposition is not easy to control, and the utilization rate of the target material is low, which is only 20%~30%. At present, the rotating hollow tube magnetron sputtering target is widely applied at home and abroad. Its advantage is that the target material can rotate around the fixed strip magnet assembly, so the 360° target surface can be etched uniformly, and the utilization rate is up to 80%. Niobium sputtering target material is an important raw material for the preparation of niobium and its alloy thin films, and has a wide range of applications in the photoelectric fields such as liquid crystal flat panel display, optical lens, electronic imaging, information storage, solar cell and glass coating, as well as in corrosive environments such as ships and chemical industry. In order to ensure that niobium sputtering target material in optical coating, advanced touch screen and display industry to be more widely used.
A production method for a niobium tube target includes the following steps: a niobium tube blank is heated for the first time, the temperature of which is 700℃ ~ 950℃; The glass powder is first sprayed on the heated niobium tube billet surface, and the thickness of the glass powder for the first time is 1mm ~ 2mm; The niobium tube billet after the first spraying glass powder is heated for a second time, and the surface of the niobium tube billet after the second heating is sprayed with glass powder for a second time. The thickness of the glass powder for the second spraying is 1 ~ 2mm. The niobium tube billet after spraying glass powder was hot extruded. The hot extruded niobium tube billet was pickled. After pickling, the niobium tube billet was heat treated to obtain the niobium tube target material.
