The production method of niobium tube target includes the following steps: heating niobium tube blank for the first time; The surface of the heated niobium tube is sprayed with glass powder for the first time. The niobium tube blank sprayed with glass powder was hot extruded. The hot extruded niobium tube billet was pickled; After pickling niobium tube blank was heat treated to obtain niobium tube target material. The glass powder is sprayed to the surface of the niobium tube billet. Due to the small thermal conductivity of the glass powder, it exists between the contact surface of the niobium tube billet and the extrusion machine tool, forming a layer of insulation and oxidation resistance, so that the niobium tube billet is easy to form. On the other hand, because the surface of niobium tube is sprayed with glass powder, it has a better lubrication effect in the extrusion process, avoiding the problem of adhesion with the surface of niobium tube billet, so that the surface quality of niobium tube billet is better. At the same time, because of the lubrication effect of glass powder, the niobium tube target is easy to be extruded. The invention also provides a niobium tube target material.
A target is a material used as a cathode in sputtering deposition technology that can be re-deposited on the surface of the anode in the form of molecules, atoms or ions separated from the cathode by positive cation impact. As a kind of special electronic material with high added value, the target material is widely used as the thin film material of sputtering technology. According to the application, the target mainly includes the target for semiconductor field, the target for recording medium, the target for display film, advanced touch screen and display, optical target and superconducting target, etc.
Magnetron sputtering is one of the main technology of preparation of thin film materials, it USES ion source to produce ions, the ion through accelerating gathered in the vacuum environment, to form the high speed of ion beam, bombarding solid surface, kinetic energy of the exchange of atoms, ions and solid surface from solid surface atomic solid surface and deposition on the surface of the matrix. The bombarded solid is the raw material of the film deposited by sputtering, known as the sputtering target.
Sputtering target shapes include cuboid, cube, cylinder and irregular shape. Cuboid, cube and cylinder shaped targets are solid. In the sputtering process, circular circular permanent magnets establish circular magnetic field on the surface of the target, forming etch zone on the annular surface equidistance between the axes. Its disadvantage is that the uniformity of film deposition thickness is not easy to control, and the utilization rate of the target is low, only 20% ~ 30%. At present, the rotary hollow tube magnetron sputtering target is widely used at home and abroad. Its advantage is that the target material can rotate around the fixed strip magnet assembly, so the 360° target surface can be evenly etched, and the utilization rate is up to 80%.
