Sputtering target shapes include cuboid, cube, cylinder and irregular shape. Cuboid, cube and cylinder shaped targets are solid. In the sputtering process, circular circular permanent magnets establish circular magnetic field on the surface of the target, forming etch zone on the annular surface equidistant between the axes. Its disadvantage is that the uniformity of film deposition thickness is not easy to control, and the utilization rate of the target is low, only 20%~30%. At present, hollow tube sputtering target is widely used at home and abroad. Its advantage is that the hollow tube target can rotate around the fixed strip magnet assembly, so the 360° target surface can be evenly etched, and the utilization rate is up to 80%. Generally speaking, the grain size of the sputtering target must be controlled below 100 microns, and even the tendency of its crystal structure must be strictly controlled.
Niobium alloy sputtering target, as an important raw material for the preparation of milling alloy film materials, is widely used in optical coating, advanced touch screen and display and industrial decoration coating industry. Niobium alloy sputtering targets have high requirements for the internal grain size and surface roughness of the products, in which the axial direction grain size is uniform, the grain size is 50-100 μηι, and the surface roughness is Ra < 1.6um. Therefore, the production method of milling alloy targets has been studied in depth.
The technical problem solved is to provide a niobium alloy target and a preparation method thereof. The niobium alloy target prepared by the invention has fine grain structure and low surface roughness.
