Tantalum aluminum alloy sputtering target is a new type of sputtering target, mainly used for vacuum magnetron sputtering coating and vacuum multi-arc ion coating. It requires the sputtering target to have high density and excellent machining performance, among which, the ratio of the defined actual density to the theoretical density. At present, only the preparation methods of aluminum-tantalum rotating target and aluminum alloy sputtering target have been disclosed. For example, discloses a method of aluminum-tantalum rotating target and controllable atmosphere cold spraying to prepare aluminum-tantalum rotating target. The preparation method includes: ultrasonic cleaning and sandblasting of stainless steel matrix to make the matrix achieve appropriate roughness; In the inert gas atmosphere, the alloy transition coating is sprayed by plasma spraying. Aluminum tantalum powder with purity of not less than 99.99% was used as raw material. The powder was processed by ball milling for 3 ~ 8h and screened to obtain aluminum tantalum spray powder. The cold spraying aluminum-tantalum powder is first vacuumized in the spraying chamber and then fed into the circulating inert gas. The gas flow rate is 200 ~ 1500SCCH, the matrix rotates around the central axis at the speed of 60 ~ 150r/min, and the moving speed of the spray gun is 500 ~ 1500mm/min. The aluminum-tantalum rotating target obtained by the preparation method has high purity, high density, uniform composition, a length up to 4000mm and a thickness of 3 ~ 15mm. However, the preparation method is only suitable for the preparation of aluminum-tantalum rotating target with thin thickness, and the application range is quite limited.
An aluminum alloy sputtering target and a preparation method thereof, wherein the aluminum alloy sputtering target consists of one or more refractory metals, Al and Cu; Among them, the content of Cu is 0.1-4wt %, the content of refractory metal is 0.05-0.5wt %, and the allowance is Al. The refractory metal refers to a metal with a melting point higher than 1650℃; The refractory metal is tungsten, molybdenum, tantalum, hafnium or ruthenium. The preparation method includes three steps: melting, thermal mechanized treatment and forming processing. The thermal mechanized treatment refers to the solid solution treatment and three-way forging of the high purity alloy ingot successively, then the forging stress is eliminated by intermediate annealing treatment, and finally the multi-pass reciprocating cold rolling. The preparation method is cumbersome and has high energy consumption, so it is not suitable for large-scale popularization. Moreover, the main element of the preparation method is Al, and the content of refractory metal as alloying element will not exceed 5wt %. When the refractory metal Ta as the main element and Al as alloying element, the process of melting - mechanical treatment - molding will not be applicable, that is, the preparation method is not applicable to the sputtering target of tantalum aluminum alloy.
To sum up, it is urgent to develop an effective preparation method of tantalum aluminum alloy sputtering target using hot pressing sintering, which can not only prepare tantalum aluminum alloy sputtering target meeting the requirements of purity and density, but also reduce energy consumption and cost, which is suitable for large-scale promotion.
